3D IC Packaging Services
Starting from wafer level, we provide service from cutting the wafer by dice saw machine into individual functional pieces, bonding time in flip chip, molding, wire bonding and package them into individual functional IC.
Series of equipments has been setup in this laboratory to offer 3D IC packaging services R&D and pilot production to our customers .
Datacon 2200 evo high-accuracy multi-chip die bonder can offer for IC packaging R&D, for the complete set of equipment, you could contact us by telephone or email.
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 8” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
High Performance at High Accuracy
- Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
- High productivity, low cost-of-ownership
- Up to 4 working heads in one machine
- Multi-Chip Capability
- Single pass production for complex products
- Die attach, flip chip, multi-chip in one machine
- Epoxy writing & stamping, flux dipping
- Unbeaten Flexibility
- Die pick from wafer, waffle pack, gel pack, feeder
- Die place to carrier, boat, substrate, PCB, lead frame, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression
- MCM, SiP, Hybrids
Mr. Jacky Yan