Printed Circuit Board Resistance to Soldering Heat Test

High Reliability Reflow Simulation System

- 12 Top and Bottom Heating Zones

- 4 Cooling Zones

- 350 °C Maximum Operation Temperature

- ± 1 °C Temperature Control Accuracy

- Lead Free Application 

 

Contact:

Mr K.T. Li

Tel: +852 2788 5793

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About the Centre

Reliability Testing Centre
Reliability Testing Centre
Hong Kong Productivity Council (HKPC)

This email address is being protected from spambots. You need JavaScript enabled to view it.
HKPC Building, 78 Tat Chee Avenue, Kowloon , Hong Kong, China
2788 5783