3D SIP laboratory (SiP)
3D SiP Laboratory (phase 1) was launched in mid-2013 providing advance IC packaging R&D and small volume pilot production to the industry, in partnership with Applied Science and Technology Research Institute. 3-dimensional (3D) packaging technologies exploit the third or Z height dimension to provide a volumetric packaging solution for higher integration and performance. 3D packaging has become critical to integrating the multi-media features consumers demand in smaller, lighter products. New product designs (cell phones, digital cameras, PDAs, audio players and mobile gaming) demand that these features be delivered in innovative form factors and styling. 3D packaging is experiencing high growth and new applications by delivering the highest level of silicon integration and area efficiency at the lowest cost.
3D IC packaging services offered
Starting from wafer level, we provide service from cutting the wafer by dice saw machine into individual functional pieces, bonding time in flip chip, molding, wire bonding and package them into individual functional IC.
Series of equipments has been setup in this laboratory to offer 3D IC packaging services R&D and pilot production to our customers .
Below is one of the machines we can offer for IC packaging R&D, for the complete set of equipment, you could contact us by telephone or email.
Datacon 2200 evo high-accuracy multi-chip die bonder
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 8” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
High Performance at High Accuracy
• Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
• High productivity, low cost-of-ownership
• Up to 4 working heads in one machine
• Single pass production for complex products
• Die attach, flip chip, multi-chip in one machine
• Epoxy writing & stamping, flux dipping
• Die pick from wafer, waffle pack, gel pack, feeder
• Die place to carrier, boat, substrate, PCB, lead frame, wafer
• Hot and cold processes supported: epoxy, soldering, thermo-compression
• MCM, SiP, Hybrids
Address: Unit G03, G/F., IC Development Centre, No. 6, Science Park West Avenue, Hong Kong Science Park, Shatin, N.T., Hong Kong
Tel: +852 2629 6683 / 2629 6600